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On the growth behavior of multiple whiskers generated on Sn/Cu plating −Predicting the growth behavior of the longest whiskers using whisker length distributions

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  • Additional Information
    • Publication Information:
      Elsevier BV
    • Publication Date:
      2025
    • Collection:
      ScienceDirect (Elsevier - Open Access Articles via Crossref)
    • Accession Number:
      10.1016/j.jmrt.2025.05.033
    • Online Access:
      https://doi.org/10.1016/j.jmrt.2025.05.033
      https://api.elsevier.com/content/article/PII:S2238785425011871?httpAccept=text/xml
      https://api.elsevier.com/content/article/PII:S2238785425011871?httpAccept=text/plain
    • Rights:
      https://www.elsevier.com/tdm/userlicense/1.0/ ; https://www.elsevier.com/legal/tdmrep-license ; http://creativecommons.org/licenses/by/4.0/
    • Accession Number:
      edsbas.E49222A3