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BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES

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  • Publication Date:
    November 29, 2012
  • Additional Information
    • Document Number:
      20120299180
    • Appl. No:
      13/565785
    • Application Filed:
      August 02, 2012
    • Abstract:
      A bonding pad structure positioned on an integrated circuit includes a connecting pad, an insulation layer and a gold bump. The connecting pad is formed on the integrated circuit. The insulation layer is formed on the connecting pad, where the insulation layer has only one opening and a shape of the opening includes at least a bend. The gold bump is formed on the insulation layer, where the gold bump is electrically connected to the connecting pad through the opening of the insulation layer.
    • Inventors:
      Yang, Yu-Ju (Hsin-Chu City, TW); Lu, Chih-Hung (Hsinchu City, TW)
    • Claim:
      1. A bonding pad structure, positioned on an integrated circuit, comprising: a connecting pad, formed on the integrated circuit; an insulation layer, formed on the connecting pad, wherein the insulation layer has only one opening and a shape of the opening includes at least a bend; and a gold bump, formed on the insulation layer, wherein the gold bump is electrically connected to the connecting pad through the opening of the insulation layer; wherein the opening comprises a “fish-bone” shaped opening area.
    • Claim:
      2. An integrated circuit comprising a plurality of bonding pad structures, wherein each of the bonding pad structures comprises: a connecting pad, formed on the integrated circuit; an insulation layer, formed on the connecting pad, wherein the insulation layer has only one opening and a shape of the opening includes at least a bend; and a gold bump, formed on the insulation layer, wherein the gold bump is electrically connected to the connecting pad through the opening of the insulation layer; wherein the opening comprises a “fish-bone” shaped opening area.
    • Current U.S. Class:
      257/737
    • Current International Class:
      01
    • Accession Number:
      edspap.20120299180