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Academic Journal

Thermal aging of conductive and dielectric inks for flexible printed electronics: Toward reliable strain gauge application

Subjects: Conductive and dielectric inks; Condition monitoring; Metal strain Gauges

  • Source: ISSN: 2352-4928 ; Materials Today Communications ; https://hal.science/hal-05375734 ; Materials Today Communications, 2026, 50, pp.114346. ⟨10.1016/j.mtcomm.2025.114346⟩.

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Conference

Improving Supercomputer Usage with Aging Awareness

Subjects: Aging; Resilience; High Performance ComputingSt. Louis; Missouri; United States

  • Source: SC Workshops '25: Proceedings of the SC '25 Workshops of the International Conference for High Performance Computing, Networking, Storage and Analysis ; Sustainable Supercomputing (Workshop of SC25) ;

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Academic Journal

Influence of aging on visual attention and peripheral perception

Subjects: spatial attention; dorsal pathway; peripheral perception

  • Source: ISSN: 1534-7362 ; Journal of Vision ; https://hal.science/hal-05340738 ; Journal of Vision, 2025, 25 (12), pp.1. ⟨10.1167/jov.25.12.1⟩.

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Academic Journal

Chemical Evolution of Monoterpene-Derived Secondary Organic Aerosols during Dark Aging

Subjects: mass spectrometry; ozonolysis; α-pinene

  • Source: EISSN: 2837-1402 ; ACS ES&T Air ; https://hal.science/hal-05349822 ; ACS ES&T Air, 2025, ⟨10.1021/acsestair.5c00196⟩

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Conference

From emotional recognition to emotional cognition in aging : Investigating the association between aging and cognitive appraisal inference.

Subjects: Cognitive appraisal; Emotion; AgingEdmonton (Alberta)Edmonton (Alberta), Canada

  • Source: 34th Annual Meeting of Canadian Society for Brain, Behavior and Cognitive Sciencehttps://hal.science/hal-0484985334th Annual Meeting of Canadian Society for Brain, Behavior and Cognitive

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Conference

Early stage of cheese making, a two-step aging dynamics in soft protein gels

Subjects: xpcs; aging; rheologyViena; Austria

  • Source: ESI Workshop 2024, Vienna, Austria: Linking Microscopic Processes to the Macroscopic Rheological Properties in Inert and Living Soft Materials ; https://hal.science/hal-04784003 ; ESI Workshop 2024,

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