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Academic Journal

Investigation of CDM ESD Protection Capability Among Power-Rail ESD Clamp Circuits in CMOS ICs With Decoupling Capacitors

Authors : Yi-Chun Huang; Ming-Dou Ker

Subjects: Electrostatic discharge (ESD); power-rail ESD clamp circuit; charged-device model (CDM)

Source: IEEE Journal of the Electron Devices Society, Vol 11, Pp 84-94 (2023)

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Academic Journal

Transient Liquid Phase Diffusion Bonding of Ni 3 Al Superalloy with Low-Boron Nickel-Base Powder Interlayer

Authors : Zhifeng Wen; Qi Li; Fengmei Liu

Subjects: TLP diffusion bonding; interlayer; superalloy

Source: Materials, Vol 16, Iss 2554, p 2554 (2023)

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Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere

Authors : Siliang He; Bifu Xiong; Fangyi Xu

Subjects: TLP bonding; porous Cu; formic acid

Source: Materials, Vol 16, Iss 2389, p 2389 (2023)

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Analyze Scalable Sudoku-Type DTSCR ESD Protection Array Structures in 22nm FDSOI

Authors : Cheng Li; Feilong Zhang; Chenkun Wang

Subjects: SCR; DTSCR; sudoku

Source: IEEE Journal of the Electron Devices Society, Vol 9, Pp 1137-1144 (2021)

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Academic Journal

Investigating Graphene gNEMS ESD Switch for Design Optimization

Authors : Cheng Li; Mengfu Di; Zijin Pan

Subjects: Graphene; gNEMS; FEM

Source: IEEE Journal of the Electron Devices Society, Vol 9, Pp 1172-1180 (2021)

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Academic Journal

ESD Design Verification Aided by Mixed-Mode Multiple-Stimuli ESD Simulation

Authors : Mengfu Di; Zijin Pan; Cheng Li

Subjects: CDM; ESD; HBM

Source: IEEE Journal of the Electron Devices Society, Vol 9, Pp 1194-1201 (2021)

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Academic Journal

A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging

Authors : Jintao Wang; Xinjie Wang; Lin Zhang

Subjects: TLP; Cu@Sn; integrated packaging

Source: Materials, Vol 15, Iss 914, p 914 (2022)

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A New Behavioral Model of Gate-Grounded NMOS for Simulating Snapback Characteristics

Authors : Yize Wang; Guangyi Lu; Yuan Wang

Subjects: Electrostatic discharge (ESD); gate-grounded NMOS (ggNMOS); transmission line pulsing (TLP) test

Source: IEEE Access, Vol 8, Pp 64730-64738 (2020)

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Academic Journal

Dynamic Analysis of a Tension Leg Platforms (TLPs) Inspired by Parallel Robotic Manipulators

Authors : Mamon M. Horoub

Subjects: Marine platforms; TLP; robotic manipulators

Source: IEEE Access, Vol 8, Pp 35222-35230 (2020)

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Academic Journal

A New On-Chip ESD Strategy Using TFETs-TCAD Based Device and Network Simulations

Authors : Radhakrishnan Sithanandam; Mamidala Jagadesh Kumar

Subjects: Tunneling field effect transistor (TFET); electrostatic discharge (ESD); silicon on insulator (SOI)

Source: IEEE Journal of the Electron Devices Society, Vol 6, Pp 298-308 (2018)

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