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Apparatus and method for coating removal

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Dielectric liners on through glass vias

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Integrated ultrasonics and megasonics cleaning

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Method of improving the adhesion strength of metal-organic interfaces in electronic devices

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Secondary electron yield engineering of copper surfaces by 532 nm ultrashort laser pulses

• Authors : Pierre Lorenz; Elena Bez; Marcel Himmerlich

Subjects: 0209 industrial biotechnology; 02 engineering and technology

• Source: Procedia CIRP. 111:662-666

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Method for the rapid processing of polymer layers in support of imidization processes and fan out wafer level packaging including efficient drying of precursor layers

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Method of using processing oven

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Increasing adhesion of metal-organic interfaces by silane vapor treatment

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Beating the blues: engineering cryptochrome expression improves soybean yield: engineering cryptochrome expression improves soybean yield

• Authors : Pierik, Ronald

Subjects: Cryptochromes; 0301 basic medicine; 03 medical and health sciences

• Source: Molecular Plant. 14:202-204

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Batch processing oven and operating methods

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